See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of Supertex products in 8L
SOIC (0.150”) package at MMT Assembly for FAB process Code D (BIC1).
Assembled at NSEB
Assembled at MMT
Impacts to Data
To improve productivity as part of the
integration of Supertex and Microchip.
April 25, 2015 (date code: 1517)
NOTE: Please be advised that after the
estimated first ship date customers may receive pre and post change parts.
Distinguish Revised from Unrevised Devices:
July 22, 2014: Issued initial notification.
Please review the attached letter regarding new
options available for Supertex customers to receive and/or view PCN after July