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Product Change Notification - JAON-01TTTP785   (Convert To PDF)


Date:
04 Jul 2014
Product Category:
Memory; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers
Notification subject:
CCB 1380.03 Final Notice: Qualification of palladium coated copper (PdCu) bond wire at MMT assembly site for selected 160K wafer technology in 20L, 18L, 14L and 8L PDIP packages
Notification text:

PCN Status:
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-01TTTP785_Affected_CPN.xls
PCN_JAON-01TTTP785_Affected_CPN.pdf

Description of Change:
Qualification of palladium coated copper (PdCu) bond wire at MMT assembly site for selected 160K wafer technology in 20L, 18L, 14L and 8L PDIP packages.

NOTE: Selected products are non-automotive analog, memory and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

Impacts to Data Sheet:
None

Reason for Change:
To improve manufacturability

Change Implementation Status:
Complete

Estimated First Ship Date:
August 1, 2014 (date code: 1431)

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:
Traceability code

Revision History:
March 17, 2014: Issued initial notification using the Notification ID IIRA-27UGCS142.
July 04, 2014: Issued final notification using the Notification ID JAON-01TTTP785. Revised the subject to only include the qualification of 160K wafer technology. Attached the qualification report. Revised the estimated first ship date from April 1, 2014 to August 1, 2014.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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