See attachments of affected catalog part
numbers (CPN) labeled as…
Qualification of palladium
coated copper (PdCu) bond wire at MMT assembly site for selected 160K wafer
technology in 20L, 18L, 14L and 8L PDIP packages.
NOTE: Selected products are
non-automotive analog, memory and PIC MCU devices. Please review the affected
CPN lists (attached) to identify the actual parts affected.
Impacts to Data
To improve manufacturability
August 1, 2014 (date code: 1431)
NOTE: Please be advised that after the
estimated first ship date customers may receive pre and post change parts.
Distinguish Revised from Unrevised Devices:
March 17, 2014: Issued initial notification
using the Notification ID IIRA-27UGCS142.
July 04, 2014: Issued final notification
using the Notification ID JAON-01TTTP785. Revised the subject to only include the
qualification of 160K wafer technology. Attached the qualification report.
Revised the estimated first ship date from April 1, 2014 to August 1, 2014.
The change described in this PCN does not alter Microchip’s
current regulatory compliance regarding the material content of the applicable