Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire at MMT assembly site for selected 90K, 120K and 121K wafer technology in 20L, 18L, 14L, and 8L PDIP packages.
NOTE: Selected products are non-automotive analog, memory and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Date:
August 1, 2014 (date code: 1431)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
March 17, 2014: Issued initial notification.
June 17, 2014: Issued final notification. Revised the subject to only include the qualification of 90K, 120K and 121K wafer technology. Attached the qualification report. Revised the estimated first ship date from April 1, 2014 to August 1, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.