Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire for selected 200K products available in the 8L and 28L SOIC packages at MTAI assembly site.
NOTE: Selected products are non-automotive MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Date:
May 30, 2014 (date code: 1422)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
April 22, 2014: Issued initial notification.
May 28, 2014: Issued final notification. Attached the qualification report. Revised the estimated first ship date from May 16, 2014 to May 30, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.