Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire for selected 0.18um products in the 100L TQFP package at MTAI assembly site.
NOTE: Selected products are non-automotive for standalone PIC MCU products. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
May 16, 2014 (Date code: 1420)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
February 11, 2014: Issued initial notification.
May 15, 2014: Issued final notification. Removed the 200K process technology from the final notification subject and description. Attached the qualification report. Revised the estimated first ship date from April 25, 2014 to May 16, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.