Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of HR-5104 die attach film for 24AA1025, 24AA1026, 24FC1025, 24FC1026, 24LC1025 and 24LC1026 device families in the 8L SOIC package at NSEB (UTL) assembly site.
HS-231W die attach film
HR-5104 die attach film
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Date:
July 15, 2014 (date code: 1429)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
April 28, 2014: Issued initial notification.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.