Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire for selected 200K products available in the 40L, 18L, 8L PDIP and 28L SPDIP packages at MTAI assembly site.
NOTE: Selected products are non-automotive PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Date:
May 2, 2014 (date code: 1418)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
April 22, 2014: Issued initial notification.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.