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Product Change Notification - IIRA-31UJIT895   (Convert To PDF)


Date:
22 Apr 2014
Product Category:
Memory; Touch Sensing Technologies; 8-bit Microcontrollers; 16-bit Microcontrollers and Digital Signal Controllers
Notification subject:
CCB 1155.31 Initial Notice: Qualification of palladium coated copper (PdCu) bond wire for selected 200K products available in the 8L and 28L SOIC packages at MTAI assembly site.
Notification text:

PCN Status:

Initial notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_IIRA-31UJIT895_Affected_CPN.xls

PCN_IIRA-31UJIT895_Affected_CPN.pdf

 

Description of Change:

Qualification of palladium coated copper (PdCu) bond wire for selected 200K products available in the 8L and 28L SOIC packages at MTAI assembly site.

 

NOTE: Selected products are non-automotive PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

In Progress

 

Estimated First Ship Date:

May 16, 2014 (date code: 1420)

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:

Traceability code

 

Revision History:

April 22, 2014: Issued initial notification.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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