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Product Change Notification - IIRA-19HYJU812   (Convert To PDF)


Date:
26 Mar 2014
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers
Notification subject:
CCB 1361.01 Final Notification: Qualification of palladium coated copper (PdCu) bond wire for selected products available in 28L SPDIP package at ALPH (MMT) assembly site.
Notification text:

PCN Status: 

Final notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_IIRA-19HYJU812_Affected_CPN.xls

PCN_IIRA-19HYJU812_Affected_CPN.pdf

 

Description of Change:

Qualification of palladium coated copper (PdCu) bond wire for selected products available in 28L SPDIP package at ALPH (MMT) assembly site.

 

NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.      

 

Pre Change:

Gold (Au) wire

 

Post Change:

Palladium coated copper (PdCu) bond wire

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

In progress

 

Estimated First Ship Dates:

April 10, 2014 (date code: 1415)

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

December 26, 2013: Issued initial notification.

March 26, 2014: Issued final notification. Attached the qualification report. Revised the estimated first ship date from March 30, 2014 to April 10, 2014.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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