Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of palladium coated copper (PdCu) bond wire for selected products available in 28L SPDIP package at ALPH (MMT) assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
April 10, 2014 (date code: 1415)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
December 26, 2013: Issued initial notification.
March 26, 2014: Issued final notification. Attached the qualification report. Revised the estimated first ship date from March 30, 2014 to April 10, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.