Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in 64L TQFP and 44L TQFP packages with palladium coated copper (PdCu) bond wire for 200K and 0.18um process technologies at MTAI assembly site.
NOTE: Selected products are non-automotive for standalone PIC MCU products. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
March 28, 2014 (Date code: 1413)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
February 11, 2014: Initial notification issue date.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.