Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

Product Change Notification - CYER-09EMYS877   (Convert To PDF)


Date:
06 Feb 2014
Product Category:
8-bit Microcontrollers
Notification subject:
CCB 1155.09 Final Notification: Qualification of selected products available in the 40L PDIP and 28L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
Notification text:

PCN Status: 

Final notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_CYER-09EMYS877_Affected_CPN.xls

PCN_CYER-09EMYS877_Affected_CPN.pdf

 

Description of Change:

Qualification of selected products available in the 40L PDIP and 28L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.

 

NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.      

 

Pre Change:

Gold (Au) wire

 

Post Change:

Palladium coated copper (PdCu) bond wire

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

In progress

 

Estimated First Ship Dates:

PIC MCU Devices: October 18, 2013 (Date code: 1342)  

Analog Devices: January 17, 2014 (Date code: 1403)

PIC16C55/57/71 Devices: February 28, 2014 (Date code 1409)

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

August 23, 2013: Initial notification issue date.

September 5, 2013: Final notification issue date. Attached qualification report.

December 17, 2013: Revised PCN to include Analog devices. Revised the affected parts list to include analog devices and included the estimated first ship date. Revised the estimated first ship date for analog devices only to 1/17/2014.

February 6, 2014: Revised PCN to include PIC16C55/57/71 devices. Revised the affected parts list to include PIC16C55/57/71 devices and included the estimated first ship date. Revised the estimated first ship date for PIC16C55/57/71 devices only to 2/28/2014.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.






Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

If you wish to change your product/process change notification (PCN) profile please log on to our website at http://www.microchip.com/PCN sign into myMICROCHIP to open the myMICROCHIP home page, then select a profile option from the left navigation bar.

To opt out of future offer or information emails (other than product change notification emails), click here to go to microchipDIRECT and login, then click on the "My account" link, click on "Update profile" and un-check the box that states "Future offers or information about Microchip's products or services."