Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
Devices Previously Identified: October 18, 2013 (Date code: 1342)
Devices added 12/18/2013: January 17, 2014 (Date code: 1403)
Devices added 2/6/2014: February 28/2014 (Date code: 1409)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
August 23, 2013: Initial notification issue date.
September 17, 2013: Final notification issue date. Attached qualification report.
December 18, 2013: Revised PCN to include various devices that will be affected by this change. Revised the attached parts affects list so show which devices were added and the estimated first ship date for all devises. Added the new estimated first ship date of 1/17/2014 for the newly added devices.
February 6, 2014: Revised PCN to include various devices that will be affected by this change. Revised the attached parts affects list so show which devices were added and the estimated first ship date for all devises. Added the new estimated first ship date of 2/28/2014 for the newly added devices.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.