Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm and 4x4x0.9mm) and 16L QFN (4x4x0.9mm and 3x3x0.9mm) packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Date:
March 28, 2014 (date code: 1413)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
January 9, 2014: Issued initial notification.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.