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Product Change Notification - IIRA-19HYJU812   (Convert To PDF)


Date:
26 Dec 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers
Notification subject:
CCB 1361.01 Initial Notification: Qualification of selected products available in the 28L SPDIP package with palladium coated copper (PdCu) bond wire at MMT (ALPH) assembly site.
Notification text:

PCN Status: 

Initial notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_IIRA-19HYJU812_Affected_CPN.xls

PCN_IIRA-19HYJU812_Affected_CPN.pdf

 

Description of Change:

Qualification of selected products available in the 28L SPDIP package with palladium coated copper (PdCu) bond wire at MMT (ALPH) assembly site.

 

NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.      

 

Pre Change:

Gold (Au) wire

 

Post Change:

Palladium coated copper (PdCu) bond wire

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

In progress

 

Estimated First Ship Dates:

March 30, 2014 (date code: 1413)

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

December 26, 2013: Issued initial notification.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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