Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in the 28L SPDIP package with palladium coated copper (PdCu) bond wire at MMT (ALPH) assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
March 30, 2014 (date code: 1413)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
December 26, 2013: Issued initial notification.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.