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Product Change Notification - CYER-27ZBHN138   (Convert To PDF)

18 Dec 2013
Product Category:
RF and Security; Analog (Thermal, Power Management & Safety); Analog (Linear & Mixed Signal) AND Interface
Notification subject:
CCB 1155.04 Final Notification: Qualification of selected products available in the 8L SOIC package with palladium coated copper (PdCu) bond wire at MTAI assembly site.
Notification text:

PCN Status: 

Final notification


Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…




Description of Change:

Qualification of selected products available in the 8L SOIC package with palladium coated copper (PdCu) bond wire at MTAI assembly site.


NOTE: Selected products are non-automotive standalone analog and PIC MCU and Analog devices. Please review the affected CPN lists (attached) to identify the actual parts affected.           


Pre Change:

Gold (Au) wire


Post Change:

Palladium coated copper (PdCu) wire


Impacts to Data Sheet:



Reason for Change:

To improve manufacturability


Change Implementation Status:



Estimated First Ship Dates:

Devices Previously Identified: October 18, 2013 (Date code: 1342)

Devices added 12/18/2013: January 17, 2014 (Date code: 1403)


NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.


Markings to Distinguish Revised from Unrevised Devices:   

Traceability code


Revision History:

September 17, 2013: Final notification issue date.

December 18, 2013: Revised PCN to include various devices that will be affected by this change. Revised the attached parts affects list so show which devices were added and the estimated first ship date for all devises. Added the new estimated first ship date of 1/17/2014 for the newly added devices.


The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.

Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

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