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Product Change Notification - CYER-27BVXY633   (Convert To PDF)

17 Dec 2013
Product Category:
Analog (Linear & Mixed Signal) AND Interface
Notification subject:
CCB 1155.03 Final Notification: Qualification of selected products available in the 28L SOIC package with palladium coated copper (PdCu) wire at MTAI assembly site.
Notification text:

PCN Status: 

Final notification


Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…




Description of Change:

Qualification of selected products available in the 28L SOIC package with palladium coated copper (PdCu) wire at MTAI assembly site.   


NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached below) to identify the actual parts affected.     


Pre Change:

Gold (Au) wire


Post Change:

Palladium coated copper (PdCu) wire


Impacts to Data Sheet:



Reason for Change:

To improve manufacturability


Change Implementation Status:



Estimated First Ship Dates:

Remaining Devices: November 15, 2013 (Date code: 1346)

TC514 Device Families: January 17, 2014 (Date code: 1403)


NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.


Markings to Distinguish Revised from Unrevised Devices:   

Traceability code


Revision History:

August 29, 2013: Final notification issue date.

December 17, 2013: Revised PCN to include TC514 device families. Revised the affected parts list to include TC514 device families and included the estimated first ship date. Revised the estimated first ship date for TC514 device families only to 1/17/2014.


The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.

Please contact your local Microchip sales office with questions or concerns regarding this notification.

Terms and Conditions:

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