Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in the 40L PDIP and 28L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
PIC MCU Devices: October 18, 2013 (Date code: 1342)
Analog Devices: January 17, 2014 (Date code: 1403)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
August 23, 2013: Initial notification issue date.
September 5, 2013: Final notification issue date. Attached qualification report.
December 17, 2013: Revised PCN to include Analog devices. Revised the affected parts list to include analog devices and included the estimated first ship date. Revised the estimated first ship date for analog devices only to 1/17/2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.