Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in the 44L TQFP package with palladium coated copper (PdCu) wire at MTAI assembly site.
NOTE: Selected products are non-automotive standalone PIC MCU and Analog devices. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
PIC MCU Devices: June 7, 2013 (Date code: 1310)
Analog Devices: January 17, 2014 (Date code: 1403)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
October 24, 2012 – Final notification issue date.
May 22, 2013: Revised PCN to include revised qualification reports, revised the parts affected list, and revised the estimated first ship date from 1/24/2013 to 6/7/2013.
December 17, 2013: Revised PCN to include Analog devices. Revised the affected parts list to include analog devices and included the estimated first ship date. Revised the estimated first ship date for analog devices only to 1/17/2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.