Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of an additional mold compound G600V for the 6L SOT-23 COL package with standard lead-frame at MTAI assembly site.
Impacts to Data Sheet:
Reason for Change:
To Improve On-Time Delivery Performance
Change Implementation Status:
Estimated First Ship Date:
January 10, 2014 (date code: 1402)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
September 4, 2013: Issued initial notification.
December 17, 2013: Issued final notification. Attached the qualification report. Revised estimated first ship date from November 15, 2013 to January 10, 2014.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.