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Product Change Notification - CYER-29OWRG732   (Convert To PDF)


Date:
17 Dec 2013
Product Category:
Analog (Thermal, Power Management & Safety); 8-bit Microcontrollers
Notification subject:
CCB 1330.01 Final Notice: Qualification of an additional mold compound G600V for the 6L SOT-23 COL package with standard lead-frame at MTAI assembly site.
Notification text:

PCN Status: 

Final notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_CYER-29OWRG732_Affected_CPN.xls

PCN_CYER-29OWRG732_Affected_CPN.pdf

 

Description of Change:

Qualification of an additional mold compound G600V for the 6L SOT-23 COL package with standard lead-frame at MTAI assembly site.

 

Impacts to Data Sheet: 

None

 

Reason for Change:

To Improve On-Time Delivery Performance     

 

Change Implementation Status:

In Progress

 

Estimated First Ship Date:

January 10, 2014 (date code: 1402)

 

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

September 4, 2013: Issued initial notification.

December 17, 2013: Issued final notification. Attached the qualification report. Revised estimated first ship date from November 15, 2013 to January 10, 2014.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.




Please contact your local Microchip sales office with questions or concerns regarding this notification.

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