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Product Change Notification - IIRA-15FPXM236   (Convert To PDF)


Date:
21 Oct 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; 8-bit Microcontrollers
Notification subject:
CCB 1155.18 Final Notification: Qualification of selected products available in the 80L TQFP package with palladium coated copper (PdCu) bond wire at MTAI assembly site.
Notification text:

PCN Status: 

Final notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_IIRA-15FPXM236_Affected_CPN.xls

PCN_IIRA-15FPXM236_Affected_CPN.pdf

 

Description of Change:

Qualification of selected products available in the 80L TQFP package with palladium coated copper (PdCu) bond wire at MTAI assembly site.

 

NOTE: Selected products are non-automotive for standalone PIC MCU products. Please review the affected CPN lists (attached) to identify the actual parts affected.           

 

Pre Change:

Gold (Au) wire

 

Post Change:

Palladium coated copper (PdCu) wire

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

Complete

 

Estimated First Ship Dates:

December 13, 2013 (Date code: 1350)

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

October 21, 2013: Final notification issue date.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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