i'm designing a board wwhich hosts a RN2483.
It's a 6 six layer board : SIG1/GND/SIG2/SIG3/VCC/SIG4. It's safe to put a grounf plane under the module and use stiching vias ? From the datasheet the module is sorrounded by top and bottom ground plane and stiching vias between them . Do you confirm ?
My fear is to lose RF signal integrity .
Could you help please ?