• AVR Freaks

Hot!PIC24EP256GP206 Package Question (TQFP64)

Author
Katsu
New Member
  • Total Posts : 5
  • Reward points : 0
  • Joined: 2019/07/02 01:41:18
  • Location: 0
  • Status: offline
2019/12/25 04:07:02 (permalink)
0

PIC24EP256GP206 Package Question (TQFP64)

Hello.

I referred to the PIC24EP256GP206 datasheet.
Page 19 shows the TQFP64 Pin Diagram.
No. 3 in the note describes the heat radiation pad.

The outline is described on page 505.
There is no pad in "RECOMENDED LAND PATERRN" on page 506.


Is the PIC24EP256GP206 correct with the recognition that a heat dissipation pad is not required?
 Regards.
#1

2 Replies Related Threads

    Mysil
    Super Member
    • Total Posts : 3578
    • Reward points : 0
    • Joined: 2012/07/01 04:19:50
    • Location: Norway
    • Status: offline
    Re: PIC24EP256GP206 Package Question (TQFP64) 2019/12/25 08:59:44 (permalink)
    0
    Hi,
    As far as I can understand, the thermal resistance data in Table 30-3,
    48.3 C/W  is for 64 pin TQFP package without a thermal pad in the package,
    and do not require a thermal pad or thermal vias in the board.
    The 64 pin TQFP package is still better than 28 pin SPDIP or SOIC packages that may mount the same chip with the same temperature limitations.
    64 pin TQFP package with thermal pad, mounted on a board with thermal vias, should have thermal resistance from Chip to Ambient around 25 C/W.
     
    With temperature limits and other data given in Table 30-2, there should be sufficient data available, for you to do your own calculations.
     
        Mysil
    #2
    Katsu
    New Member
    • Total Posts : 5
    • Reward points : 0
    • Joined: 2019/07/02 01:41:18
    • Location: 0
    • Status: offline
    Re: PIC24EP256GP206 Package Question (TQFP64) 2019/12/25 17:29:06 (permalink)
    0
    To Mysil.
     
    I understand that there is no thermal pad in this device and that there is no thermal problem under my working conditions.
    Thanks for the support.
     
    Regards
    #3
    Jump to:
    © 2020 APG vNext Commercial Version 4.5