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Package Drawings

Package Drawings

Microchip Technology Inc. products are available in a broad range of packages, from the tiny 3-lead SC-70 to the 144-pin TQFP, and almost everything in between. Options include small outline packages such as wafer level chipscale (CSP), Ultra-Dual Flat No Lead (UDFN), Ultra-Quad Flat No Lead (UQFN), plastic Shrink Small Outline (SSOP), plastic Think Shrink Small Outline (TSSOP), plastic Small Outline (SOIC), Thin Quad Flat Pack (TQFP), Ball Grid Array (BGA), and Plastic Dual In-Line (PDIP).

Microchip's Focus Product Selector Guide includes information on specific packages that are available for each product. Detailed packaging information can be found in the Package Drawing and Dimensions Specification. Additional information is available for Pb-free and RoHS Compliance.