Microchip Technology Inc

System-in-Package (SiP) Solutions

The Microchip multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications demanding for higher levels of integration and lower costs coupled with an awareness of complete system solution. The Microchip SiPs incorporate:

  • LIN 1.3, 2.0, 2.1, 2.2, 2.2A and SAE J2602-2 compliant LIN transceiver
  • Built-in voltage regulator - 3.3V or 5V output voltages and output current up to 85mA
  • Programmable Window Watchdog via external resistor
  • AVR® , ARM Cortex M0+ microcontroller (with peripheral touch controller) or PIC microcontroller in single package
Lin Solutions
Some SiPs have all pins of the LIN-SBC and the microcontroller are bonded out to provide customers the same flexibility for their applications as they have when using discrete parts. Other have some internal connections in order to have more features but smaller package.