Microchip Technology Inc

23K256

In Production

The Microchip Technology Inc. 23X256 are 256 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X256 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.

 

    Features

      • Max. Clock 20 MHz
      • Low-Power CMOS Technology:     -  Read Current: 3 mA at 1 MHz     -  Standby Current: 4 µA Max. at 3.6V
      • 32,768 x 8-bit Organization
      • 32-Byte Page
      • HOLD pin
      • Flexible Operating modes:     -  Byte read and write     -  Page mode (32 Byte Page)     -  Sequential mode
      • Sequential Read/Write
    Parameter Name
    Value
    Density
    256K bits
    Op. Volt Range (V)
    2.7 to 3.6
    Max. Clock Freq.
    20 MHz
    Page Size (bytes)
    32
    Temp Range (°C)
    -40°C to +125°C
    Endurance
    Unlimited
    Bus Modes
    SPI
    Documentation
    Data Sheets
    10/05/2011
    587KB
      Application Notes
     
     
     
    AppNote
    02/02/2009
    345KB
    AppNote
    11/28/2012
    196KB
    AppNote
    04/13/2009
    505KB
    AppNote
    05/11/2009
    769KB
    AppNote
    06/30/2009
    764KB
    AppNote
    08/24/2009
    328KB
      Brochures
     
     
     
    Brochures
    02/05/2015
    4696KB
    Brochures
    09/10/2014
    10216KB
    Brochures
    07/22/2010
    725KB
    Brochures
    10/06/2014
    3370KB
      Sell Sheets
     
     
     
     
    Sell Sheets
    07/11/2011
    182KB
      IBIS
     
     
     
     
    IBIS
    01/29/2013
    91KB
      Webinars
     
     
     
     
    Webinars
    01/27/2010
    26649KB
    Webinars
    01/27/2010
    16038KB
      Product Selection Tools
     
     
     
     
    Product Line Card
    04/13/2016
    10173KB
      aspxVerilog
     
     
     
     
    Verilog
    01/29/2013
    6KB
      Video
     
     
     
     
    Video
    07/20/2009
    27276KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    23K256-E/P
    8
    PDIP
    -40C to +125C
    TUBE
    1.18
    1.14
    1.09
    1.03
    0.97
     
    23K256-E/SN
    8
    SOIC
    -40C to +125C
    TUBE
    1.12
    1.08
    1.04
    0.98
    0.92
     
    23K256-E/ST
    8
    TSSOP
    -40C to +125C
    TUBE
    1.16
    1.12
    1.07
    1.02
    0.96
     
    23K256-I/P
    8
    PDIP
    -40C to +85C
    TUBE
    1.12
    1.08
    1.04
    0.98
    0.92
    23K256-I/SN
    8
    SOIC
    -40C to +85C
    TUBE
    1.06
    1.02
    0.98
    0.93
    0.87
    23K256-I/ST
    8
    TSSOP
    -40C to +85C
    TUBE
    1.10
    1.06
    1.02
    0.96
    0.91
    23K256T-E/SN
    8
    SOIC
    -40C to +125C
    T/R
    1.12
    1.08
    1.04
    0.98
    0.92
     
    23K256T-E/ST
    8
    TSSOP
    -40C to +125C
    T/R
    1.16
    1.12
    1.07
    1.02
    0.96
     
    23K256T-I/SN
    8
    SOIC
    -40C to +85C
    T/R
    1.06
    1.02
    0.98
    0.93
    0.87
     
    23K256T-I/ST
    8
    TSSOP
    -40C to +85C
    T/R
    1.10
    1.06
    1.02
    0.96
    0.91
     

    ** Device not available to purchase online. Please contact a sales office for pricing information.
    Open a microchipDIRECT account today!

    Similar Devices
    Product
    Memory Size
    Memory Speed
    Package
    Price5K
    256K
    20 MHz
    PDIP-8, SOIC 150mil-8, TSSOP-8
    $0.87
    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    23K256-E/P
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    23K256-I/P
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    23K256T-I/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    23K256-I/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    23K256-E/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    23K256T-E/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    23K256T-I/ST
    0.033000
    0.215600
    8
    TSSOP
    4.4mm
    Matte Tin
    e3
    23K256-E/ST
    0.033000
    0.090000
    8
    TSSOP
    4.4mm
    Matte Tin
    e3
    23K256T-E/ST
    0.033000
    0.215600
    8
    TSSOP
    4.4mm
    Matte Tin
    e3
    23K256-I/ST
    0.033000
    0.090000
    8
    TSSOP
    4.4mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.