Microchip Technology Inc

MCP23S09

In Production

MCP23S09 is an 8-bit I/O expander with SPI interface operating at 10 MHz. The MCP23S09 is available in 18-pin PDIP (300 mil), 18-pin SOIC (300 mil) and 16-pin 3x3mm QFN package

 

    Features

        • 8-bit remote bidirectional I/O port:
          • I/O pins default to input
        • Open-drain outputs:
          • 5.5V tolerant
          • 25 mA sink
          • 200 mA total
        • Low standby current as low as 1 µA
        • High-speed SPI interface at 10 MHz
        • Configurable interrupt output pins: Configurable as active-high, active-low or open-drain
        • Configurable interrupt source: Interrupt-on-change from configured defaults or pin change
        • Polarity inversion register to configure the polarity of the input port data
        • External reset input
    Parameter Name
    Value
    Device Description
    8-bit I/O Port Expander
    Operating Voltage Range (V)
    1.8 to 5.5
    Operating Temp Range (°C)
    -40 to 125
    Interface
    SPI
    Max. Bus Frequency (kBits/s)
    10000
    Documentation
    Data Sheets
    11/09/2014
    959KB
      Brochures
     
     
     
     
    Brochures
    09/16/2014
    7598KB
      Product Selection Tools
     
     
     
     
    Product Line Card
    06/08/2017
    4167KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    MCP23S09-E/MG
    16
    QFN
    -40C to +125C
    TUBE
    1.27
    1.06
    0.96
    0.93
    0.92
    MCP23S09-E/P
    18
    PDIP
    -40C to +125C
    TUBE
    1.20
    1.00
    0.91
    0.88
    0.87
    MCP23S09-E/SO
    18
    SOIC
    -40C to +125C
    TUBE
    1.20
    1.00
    0.91
    0.88
    0.87
    MCP23S09T-E/MG
    16
    QFN
    -40C to +125C
    T/R
    1.27
    1.06
    0.96
    0.93
    0.92
    MCP23S09T-E/SO
    18
    SOIC
    -40C to +125C
    T/R
    1.27
    1.06
    0.96
    0.93
    0.92

    ** Device not available to purchase online. Please contact a sales office for pricing information.
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    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    MCP23S09-E/P
    1.248000
    2.200000
    18
    PDIP
    .300in
    Matte Tin
    e3
    MCP23S09-E/SO
    0.481000
    0.857143
    18
    SOIC
    .300in
    Matte Tin
    e3
    MCP23S09T-E/SO
    0.481000
    1.000909
    18
    SOIC
    .300in
    Matte Tin
    e3
    MCP23S09-E/MG
    0.021600
    0.041667
    16
    QFN
    3x3x0.9mm
    Matte Tin
    e3
    MCP23S09T-E/MG
    0.021600
    0.234849
    16
    QFN
    3x3x0.9mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.