Microchip Technology Inc
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MCP23S18

Status: In Production

Features:

  • 16-bit remote bidirectional I/O port
  • Open-drain outputs:
  • 5.5V tolerant
  • 25 mA sink
  • 400 mA total current out
  • Low standby current as low as 1 µA
  • High-speed I2C™ interface up to 3.4MHz
  • Single hardware address pin: Voltage input to allow up to eight devices on the bus
  • Configurable interrupt output pins: Configurable as active-high, active-low or open-drain
  • Low standby current:1 µA (typ.)
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Overview
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RoHS Information
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Device Overview

Summary

The MCP23X18 device provides 16-bit, general purpose parallel I/O expansion for I2C bus or SPI applications. The two devices differ only in the serial interface.
• MCP23018 - I2C interface
• MCP23S18 - SPI interface
The MCP23X18 consists of multiple 8-bit configuration registers for input, output and polarity selection. The system master can enable the I/Os as either inputs or outputs by writing the I/O configuration bits. The data for each input or output is kept in the corresponding input or output register. The polarity of the input port register can be inverted with the polarity inversion register. All registers can be read by the system master.

Additional Features

     

    • 16-bit remote bidirectional I/O port
    • Open-drain outputs:
    • 5.5V tolerant
    • 25 mA sink
    • 400 mA total current out
    • Low standby current as low as 1 µA
    • High-speed I2C™ interface up to 3.4MHz
    • Single hardware address pin: Voltage input to allow up to eight devices on the bus
    • Configurable interrupt output pins: Configurable as active-high, active-low or open-drain
    • Low standby current:1 µA (typ.)
Parametrics
Name
Value
Device Description
16-bit I/O Port Expander
Operating Voltage Range (V)
1.8 to 5.5
Operating Temp Range (°C)
-40 to 125
Interface
SPI
Max. Bus Frequency (kBits/s)
10000

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RoHS Information

Part Number
Device Weight
Shipping Weight
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP23S18-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
Rohs icon
efup china icon
MCP23S18T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
Rohs icon
efup china icon
MCP23S18-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
Rohs icon
efup china icon
MCP23S18-E/MJ
0.044100
0.109890
24
QFN
4x4x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
MCP23S18T-E/MJ
0.044100
0.212121
24
QFN
4x4x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
MCP23S18T-E/MJVAO
0.044100
0.212121
24
QFN
4x4x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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