Microchip Technology Inc

11LC160

In Production

Need more microcontroller pins for new features? Want to stay with a low pin-count microcontroller rather than switching to a more expensive one? Microchip’s UNI/O® bus serial EEPROM uses only one connection to the host microcontroller. This compares to two or three pins for I2C and three to six pins for Microwire or SPI buses. This proprietary bus offers advanced features like a status register and write protection on demand, along with all I/O, memory array and command functions through a single pin.

 

    Features

        • Single I/O Interface
        • 16 Kbit Memory Density
        • 2.5-5.5V Operating Voltage
        • 10-100 kHz Operating Frequency
        • 1 Million Erase/Write Cycles
        • Software Write Protect: ¼, ½, or Full Array
        • Status Register
        • Set/Erase entire memory with a single command
        • ESD Protection > 4kV
        • Noise Filtration Circuitry
    Parameter Name
    Value
    Density
    16K bit (x8)
    Op. Volt Range (V)
    2.5 to 5.5
    Max. Clock Freq.
    100 kHz
    Page Size (bytes)
    16
    Write Protect
    Quarter, Half, Whole Array
    Temp Range (°C)
    -40°C to +125°C
    Endurance
    1,000,000
    Documentation
    Data Sheets
    05/18/2011
    747KB
      Application Notes
     
     
     
    AppNote
    12/23/2005
    175KB
    AppNote
    10/30/2008
    961KB
    AppNote
    09/29/2008
    1630KB
    AppNote
    10/30/2008
    936KB
    AppNote
    10/30/2008
    265KB
    AppNote
    10/30/2008
    269KB
    AppNote
    10/30/2008
    263KB
    AppNote
    10/30/2008
    702KB
    AppNote
    10/30/2008
    860KB
    AppNote
    10/30/2008
    818KB
    AppNote
    10/30/2008
    153KB
    AppNote
    10/30/2008
    531KB
    AppNote
    10/30/2008
    236KB
    AppNote
    10/30/2008
    264KB
    AppNote
    02/04/2009
    828KB
      Brochures
     
     
     
    Brochures
    02/05/2015
    4696KB
    Brochures
    09/10/2014
    10216KB
    Brochures
    07/22/2010
    725KB
      Sell Sheets
     
     
     
     
    Sell Sheets
    07/11/2011
    182KB
      Reference Manual
     
     
     
     
    Reference Manual
    11/06/2009
    248KB
      IBIS
     
     
     
     
    IBIS
    01/29/2013
    199KB
      Webinars
     
     
     
     
    Webinars
    01/27/2010
    24625KB
    Webinars
    01/27/2010
    65664KB
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    01/27/2010
    31187KB
    Webinars
    01/27/2010
    38593KB
    Webinars
    01/27/2010
    33683KB
      Product Selection Tools
     
     
     
     
    Product Line Card
    07/31/2017
    3479KB
      Verilog
     
     
     
     
    Verilog
    01/29/2013
    14KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    11LC160-E/MS
    8
    MSOP
    -40C to +125C
    TUBE
    0.35
    0.34
    0.32
    0.30
    0.29
     
    11LC160-E/P
    8
    PDIP
    -40C to +125C
    TUBE
    0.37
    0.36
    0.34
    0.32
    0.30
     
    11LC160-E/SN
    8
    SOIC
    -40C to +125C
    TUBE
    0.32
    0.31
    0.29
    0.27
    0.26
     
    11LC160-I/MS
    8
    MSOP
    -40C to +85C
    TUBE
    0.30
    0.29
    0.27
    0.26
    0.25
    11LC160-I/P
    8
    PDIP
    -40C to +85C
    TUBE
    0.32
    0.31
    0.29
    0.27
    0.26
    11LC160-I/SN
    8
    SOIC
    -40C to +85C
    TUBE
    0.26
    0.26
    0.24
    0.23
    0.22
    11LC160T-E/MNY
    8
    TDFN
    -40C to +125C
    T/R
    0.35
    0.34
    0.32
    0.30
    0.29
     
    11LC160T-E/MS
    8
    MSOP
    -40C to +125C
    T/R
    0.35
    0.34
    0.32
    0.30
    0.29
     
    11LC160T-E/SN
    8
    SOIC
    -40C to +125C
    T/R
    0.32
    0.31
    0.29
    0.27
    0.26
     
    11LC160T-E/TT
    3
    SOT-23
    -40C to +125C
    T/R
    0.30
    0.29
    0.27
    0.26
    0.25
     
    11LC160T-I/MNY
    8
    TDFN
    -40C to +85C
    T/R
    0.30
    0.29
    0.27
    0.26
    0.25
    11LC160T-I/MS
    8
    MSOP
    -40C to +85C
    T/R
    0.30
    0.29
    0.27
    0.26
    0.25
     
    11LC160T-I/SN
    8
    SOIC
    -40C to +85C
    T/R
    0.26
    0.26
    0.24
    0.23
    0.22
     
    11LC160T-I/TT
    3
    SOT-23
    -40C to +85C
    T/R
    0.25
    0.24
    0.22
    0.21
    0.20

    ** Device not available to purchase online. Please contact a sales office for pricing information.
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    Development Tools
    • Demo & Eval Boards
    • Programmers
    • Serial EEPROM PIM PICtail Pack ( AC243003 )

      Serial

      The Serial EEPROM PIM PICtail™ Modules are a series of boards designed around Microchip Serial EEPROM devices. The boards are designed to interface with the PICtail Plus connector as well as the MPLAB® Starter Kit for Serial Memory Products and the PICkit™ 2, allowing you to get started right out of the box.

    • UNI/O Bus Parasitic Power Demo ( AC243004 )

      (Not Recommended for new design)
      UNI/O

      The UNI/O® Bus Parasitic Power Demo Board is designed to illustrate how a standard half-wave rectifier and capacitor circuit can be used to parasitically extract power for a UNI/O device from the SCIO signal as described in application note, AN1213 “Powering a UNI/O® Bus Device Through SCIO”. This reduces the number of connections necessary for adding a UNI/O device to your...

    • MPLAB Starter Kit for Memory Products ( DV243003 )

      MPLAB

      Designers of Serial EEPROM applications can enjoy the increased productivity, reduced time to market and rock-solid design that only a well thought out development system can provide. Microchip's MPLAB® Starter Kit for Serial Memory Products includes everything necessary to quickly develop a robust and reliable Serial EEPROM design, and greatly reduces the time required for system integration...

    • MPLAB PM3 Universal Device Programmer ( DV007004 )

      MPLAB

      The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

      • Socket: AC164302   PartNo: 11LC160 (8SN)
      • Socket: AC164325   PartNo: 11LC160 (8MS)
      • Socket: AC164334   PartNo: 11LC160 (8MN)
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    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    11LC160-I/P
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    11LC160-E/P
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    11LC160-I/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    11LC160T-E/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    11LC160T-I/SN
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    11LC160-E/SN
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    11LC160-E/MS
    0.025600
    0.070000
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    11LC160T-I/MS
    0.025600
    0.215600
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    11LC160T-E/MS
    0.025600
    0.215600
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    11LC160-I/MS
    0.025600
    0.070000
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    11LC160-E/TO
    0.203400
    0.219000
    3
    TO-92
    -
    Matte Tin
    e3
    11LC160-I/TO
    0.203400
    0.219000
    3
    TO-92
    -
    Matte Tin
    e3
    11LC160T-E/TT
    0.008300
    0.039000
    3
    SOT-23
    1.3mm
    Matte Tin
    e3
    11LC160T-I/TT
    0.008300
    0.039000
    3
    SOT-23
    1.3mm
    Matte Tin
    e3
    11LC160T-I/MNY
    0.014300
    0.248485
    8
    TDFN
    2x3x0.8mm
    NiPdAu
    e4
    11LC160T-E/MNY
    0.014300
    0.248485
    8
    TDFN
    2x3x0.8mm
    NiPdAu
    e4
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.