Microchip Technology Inc

PIC24FJ256GB106

In Production

Ideal for low power (<100nA standby current) and connectivity applications that benefit from the availability of multiple serial ports (3xI2C, 3xSPI), 4xUARTS, and 23 independent timers. Large amounts of RAM (16kB) memory for buffering and large (up to 256kB) Enhanced Flash program memory make it ideal for embedded control and monitoring applications. PPS (peripheral pin select) aids in configuring the most efficient pin configuration of available I/O, and CTMU provides touch support for up to 64 individual buttons. Supports USB 2.0 for device, Host, and OTG with a complete and free software stack that includes a thumb drive application stack. Available in 64, 80, and 100 pin packages.
USB Application Design Center

 

    Features

          CPU

          • Up to 16 MIPS performance
          • 16 x 16 Hardware Multiply, Single Cycle Execution
          • 12-bit x 16-bit Hardware Divider
          • C Compiler Optimized Instruction Set

          nanoWatt Power Managed Modes

          • Run, Idle and Sleep modes
          • Multiple, Switchable Clock Modes for Optimum Performance and Power Management
          • Run mode: 1 mA/MIPS, 2.0V Typical
          • Sleep mode Current Down to 100 nA Typical
          • Standby Current with 32 kHz Oscillator:2.5 uA,2.0V typical

          Flash Program Memory

          • Self-Reprogrammable under Software Control
          • 10,000 erase/write cycles
          • 20 year data retention
          • EEprom emulation capable

          System

          • Internal oscillator support - 31 kHz to 8 MHz, up to 32 MHz with 4X PLL
          • On-chip LDO Voltage Regulator
          • JTAG Boundary Scan and Flash Memory Program Support
          • Fail-Safe Clock Monitor – allows safe shutdown if clock fails
          • Watchdog Timer with separate RC oscillator

          Analog Features

          • 10-bit ADC, 16 channels, 500k samples per second
          • Three Analog comparators

          Universal Serial Bus Features

          • USB v2.0 On-the-Go compliant
          • Dual role capable, can act as either Host or Device
          • Low speed(1.5Mb/s) and full speed(12 Mb/s) operation in host mode
          • Full speed USB operaton in Device mode
          • Supports 32 endpoints
          • On-chip USB transceiver

          Peripherals

          • CTMU supports Capacitive Touch applications
          • Perpheral Pin Select allows I/O remapping of many peripherals in real time
          • 4xUART Modules with LIN and IrDA support, 4 Deep FIFO
          • 3xSPI ™ Modules with 8 Deep FIFO
          • 3xI2C™ Modules with Master and Slave Modes
          • Five 16-bit Timer Modules
          • Up to 9 Input Capture and 9 Output Compare/PWM with dedicated time base
          • Hardware RTCC, Real-Time Clock Calendar with Alarms
          • PMP, Parallel Master Port, with 16 Address Lines, and 8/16-bit Data
    Parameter Name
    Value
    Architecture
    16-bit
    CPU Speed (MIPS)
    16
    Memory Type
    Flash
    Program Memory (KB)
    256
    RAM (KB)
    16
    Temperature Range C
    -40 to 85
    Operating Voltage Range (V)
    2 to 3.6
    I/O Pins
    52
    Pin Count
    64
    System Management Features
    BOR, LVD
    POR
    Yes
    WDT
    Yes
    Internal Oscillator
    8 MHz, 31 kHz
    Digital Communication Peripherals
    4-UART
    3-SPI
    3-I2C
    Analog Peripherals
    1-A/D 16x10-bit @ 500(ksps)
    Comparators
    3
    USB
    1
    USB Interface
    FS Device/Host/OTG
    Capture/Compare/PWM Peripherals
    9/9
    PWM Resolution bits
    16
    Timers
    23 x 16-bit 11 x 32-bit
    Parallel Port
    PMP
    Cap Touch Channels
    16
    Documentation
    Data Sheets
    12/16/2009
    2804KB
      Errata
     
     
     
     
    Errata
    01/22/2013
    359KB
      Migration Documents
     
     
     
     
    Migration Documents
    03/28/2006
    770KB
      Programming Specifications
     
     
     
    Programming Specification
    02/25/2013
    10777KB
    Programming Specification
    06/24/2014
    384KB
      Application Notes
     
     
     
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      Brochures
     
     
     
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    514KB
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    4130KB
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    09/10/2014
    10216KB
      Sell Sheets
     
     
     
     
    Sell Sheets
    07/11/2011
    182KB
      Reference Manual
     
     
     
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    05/04/2016
    304KB
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    03/18/2014
    668KB
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    363KB
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    04/16/2014
    324KB
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    02/22/2013
    92KB
      Software
     
     
     
     
    Software
    12/08/2014
    3KB
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    09/24/2010
    14KB
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    06/20/2015
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    PCB artwork
    12/21/2016
    33417KB
      Quick Start Guides
     
     
     
     
    Quick Start Guides
    09/19/2005
    110KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    PIC24FJ256GB106-I/MR
    64
    QFN
    -40C to +85C
    TUBE
    5.55
    5.09
    4.61
    4.24
    4.03
    PIC24FJ256GB106-I/PT
    64
    TQFP
    -40C to +85C
    TRAY
    5.43
    4.98
    4.51
    4.15
    3.95
    PIC24FJ256GB106T-I/MR
    64
    QFN
    -40C to +85C
    T/R
    6.13
    5.63
    5.10
    4.69
    4.46
     
    PIC24FJ256GB106T-I/PT
    64
    TQFP
    -40C to +85C
    T/R
    5.45
    5.00
    4.53
    4.17
    3.96
     

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    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    PIC24FJ256GB106-I/PT
    0.286700
    2.487500
    64
    TQFP
    10x10x1mm
    Matte Tin
    e3
    PIC24FJ256GB106T-I/PT
    0.286700
    0.738333
    64
    TQFP
    10x10x1mm
    Matte Tin
    e3
    PIC24FJ256GB106T-I/MR
    0.232400
    0.370303
    64
    QFN
    9x9x0.9mm
    Matte Tin
    e3
    PIC24FJ256GB106-I/MR
    0.232400
    0.350000
    64
    QFN
    9x9x0.9mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.