Microchip Technology Inc

TC1411N

In Production

The TC1411/1411N are 1A CMOS buffer/drivers. They will not latch up under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking of either polarity occurs on the ground pin. They can accept, without damage or logic upset, up to500mA of current of either polarity being forced back into their output. All terminals are fully protected against up to 4kV of electrostatic discharge. As MOSFET drivers, the TC1411/1411N can easily switch 1000pF gate capacitance in 25nsec with matched rise and fall times, and provide low enough impedance in both the ON and the OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The rise and fall time edges are matched to allow driving short-duration inputs with greater accuracy.

 

    Features

      - Latch-Up Protected: Will Withstand
        500mA Reverse Current
      - Input Will Withstand Negative Inputs Up to 5V
      - ESD Protected: 4kV
      - Wide Operating Range: 4.5V to 16V
      - High Capacitive Load Drive Capability: 1000pF in 25nsec
      - Short Delay Time: 30nsec Typ
      - Consistent Delay Times With Changes in Supply Voltage
      - Matched Delay Times
      - Low Supply Current
           With Logic “1? Input ............... 500µA
           With Logic “0? Input ............... 100µA
      - Low Output Impedance: 8?
      - Pinout Same as TC1410/12/13
    Parameter Name
    Value
    MOSFET Driver Type
    Low Side
    Driver Type
    Single
    Configuration
    Non-inverting
    Peak Output Current (source/sink, A)
    1.0/1.0
    Output Resistance (source/sink, Ω)
    8/8
    Maximum Supply Voltage (V)
    16
    Propagation Delay (Td1/Td2, ns)
    30/30
    Rise/Fall Time (Tr/Tf, ns)
    25/25
    Capacitive Load Drive
    1000 pF in 25 ns
    Documentation
      Application Notes
     
     
     
    AppNote
    03/10/2009
    158KB
    AppNote
    10/22/2009
    136KB
    AppNote
    11/12/2002
    202KB
    AppNote
    08/03/2004
    182KB
    AppNote
    12/31/2003
    512KB
      Brochures
     
     
     
    Brochures
    10/11/2005
    1067KB
    Brochures
    10/15/2014
    11223KB
      Software Library
     
     
     
     
    Software Library
    01/10/2017
      Product Selection Tools
     
     
     
     
    Product Line Card
    06/08/2017
    4167KB
      Spice Model
     
     
     
     
    Spice Model
    02/05/2013
    5KB
      User Guides
     
     
     
     
    User Guides
    01/24/2006
    1367KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    TC1411NCOA
    8
    SOIC
    0C to +70C
    TUBE
    1.08
    0.90
    0.82
    0.68
    0.63
    TC1411NCPA
    8
    PDIP
    0C to +70C
    TUBE
    1.14
    0.95
    0.86
    0.72
    0.66
    TC1411NEOA
    8
    SOIC
    -40C to +85C
    TUBE
    1.16
    0.97
    0.88
    0.73
    0.68
    TC1411NEOA713
    8
    SOIC
    -40C to +85C
    T/R
    1.16
    0.97
    0.88
    0.73
    0.68
     
    TC1411NEPA
    8
    PDIP
    -40C to +85C
    TUBE
    1.19
    0.99
    0.90
    0.75
    0.69
    TC1411NEUA713
    8
    MSOP
    -40C to +85C
    T/R
    1.19
    0.99
    0.90
    0.75
    0.69
     
    TC1411NVOA
    8
    SOIC
    -40C to +125C
    TUBE
    1.08
    0.90
    0.82
    0.68
    0.63
     
    TC1411NVOA713
    8
    SOIC
    -40C to +125C
    T/R
    1.08
    0.90
    0.82
    0.68
    0.63
     
    TC1411NVPA
    8
    PDIP
    -40C to +125C
    TUBE
    1.27
    1.06
    0.96
    0.80
    0.74
     
    TC1411NVUA
    8
    MSOP
    -40C to +125C
    TUBE
    1.24
    1.03
    0.94
    0.78
    0.72
     
    TC1411NVUA713
    8
    MSOP
    -40C to +125C
    T/R
    1.24
    1.03
    0.94
    0.78
    0.72
     

    ** Device not available to purchase online. Please contact a sales office for pricing information.
    Open a microchipDIRECT account today!

    Development Tools
    • Demo & Eval Boards
    • 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

      8-Pin

      This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    TC1411NVPA
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    TC1411NCPA
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    TC1411NEPA
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    TC1411NCOA
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NCOA713
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NEOA
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NEOA713
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NVOA
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NVOA713
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    TC1411NVUA
    0.025600
    0.070000
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    TC1411NEUA
    0.025600
    0.070000
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    TC1411NEUA713
    0.025600
    0.215600
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    TC1411NVUA713
    0.025600
    0.215600
    8
    MSOP
    3x3mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.