Microchip Technology Inc

MSL2166

Not Recommended for new designs

The MSL2166 is a compact, high-power LED string driver that uses external current control MOSFETs to sink up to 350mA per string, with matching better than ??0.8%. The MSL2166 drives 16 parallel strings of LEDs and offers fault detection and management of open- and short-circuit LEDs. The MSL2166 features a 20MHz SPI serial interface, and supports video frame-by-frame LED string intensity control for up to eight interconnected devices, allowing active area dimming and phase-shifted pulse width modulation (PWM) outputs. They also include an advanced PWM engine that synchronizes PWM dimming to the video signal supporting forward, center, reverse and inverse PWM modes for reduced motion blur and waterfall noise.

The MSL2166 adaptively controls the DC-DC converters that power the LED strings. These Efficiency Optimizers minimize power consumption while maintaining LED current accuracy.

A unique combination of LED current control and pulse width dimming management offers simple full-screen brightness control, versatile area dimming and a consistent white point. Full-scale LED regulation current is set for each string using current sense resistors and a 10-bit register that controls global string current. The 12-bit global intensity register controls PWM dimming of all strings, and each string uses a 12-bit register to control individual string PWM dimming. The MSL2166 monitors the LED strings for open-circuit, short-circuit, loss-of-sync and over-temperature faults, and provides a hardware fault output (FLTB) to notify the microcontroller. Detailed fault status and control are available through the serial interface. Additionally, the MSL2166 includes on-chip EEPROMs that allow customizing of the register power-up states via the serial interface.

 
    Parameter Name
    Value
    Documentation
    Data Sheets
    02/01/2012
    1745KB
      Application Notes
     
     
     
    AppNote
    12/10/2016
    244KB
    AppNote
    03/01/2012
    830KB
      Brochures
     
     
     
     
    Brochures
    01/01/2013
    124KB
    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    MSL2166-DUR
    0.228200
    0.057000
    64
    VQFN
    9x9x0.9mm
    Matte Tin
    e3
    MSL2166-DU
    0.228200
    0.876923
    64
    VQFN
    9x9x0.9mm
    Matte Tin
    e3
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    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.