Microchip Technology Inc

AT17LV256

In Production

Microchip 256-Kb FPGA configuration EEPROM provides easy-to-use, cost-effective configuration memory for FPGAs. It comes in a range of packages from the 8-lead LAP to the 20-lead SOIC. This EEPROM can configure one or more FPGA devices through a simple serial-access procedure. Users can select the polarity of the reset function by programming four EEPROM bytes. The device also supports a write-protection mechanism within its programming mode.It can be programmed with industry-standard programmers, the Microchip ATDH2200E programming kit, or the Microchip ATDH2225 ISP cable.

 
    Parameter Name
    Value
    Interface Type
    Xilinx
    Density
    256Kb
    Temperature Range (V)
    -40 to 85
    Max# Operating Freq# (MHz)
    10
    Operating Voltage Range (V)
    3 to 5.5
    Documentation
    Data Sheets
    10/01/2014
    669KB
      Application Notes
     
     
     
    AppNote
    01/01/2004
    100KB
    AppNote
    09/01/2002
    78KB
    AppNote
    03/01/2004
    56KB
    AppNote
    03/01/2004
    46KB
    AppNote
    05/01/2004
    92KB
      Quick Start Guides
     
     
     
     
    Quick Start Guides
    07/01/2001
    1489KB
    Pricing & Samples
    All pricing shown in USD only.
    Part Number
    Leads
    Package Type
    Temp Range
    Packing
    1+
    26+
    100+
    1000+
    5000+
    Buy
    Sample
    AT17LV256-10CU
    8
    CASON
    -40C to +85C
    TUBE
    8.00
    7.27
    6.59
    6.09
    5.77
     
    AT17LV256-10CU-T
    8
    CASON
    -40C to +85C
    T/R
    8.00
    7.27
    6.59
    6.09
    5.77
     
    AT17LV256-10JU
    20
    PLCC
    -40C to +85C
    TUBE
    8.00
    7.27
    6.59
    6.09
    5.77
    AT17LV256-10JU-T
    20
    PLCC
    -40C to +85C
    T/R
    8.00
    7.27
    6.59
    6.09
    5.77
    AT17LV256-10NU
    8
    SOIC
    -40C to +85C
    TUBE
    8.00
    7.27
    6.59
    6.09
    5.77
    AT17LV256-10NU-T
    8
    SOIC
    -40C to +85C
    T/R
    8.00
    7.27
    6.59
    6.09
    5.77
    AT17LV256-10PU
    8
    PDIP
    -40C to +85C
    TUBE
    8.00
    7.27
    6.59
    6.09
    5.77
    AT17LV256-10SU
    20
    SOIC
    -40C to +85C
    TUBE
    9.60
    8.73
    7.91
    7.30
    6.93
    AT17LV256-10SU-T
    20
    SOIC
    -40C to +85C
    T/R
    9.60
    8.73
    7.91
    7.30
    6.93

    ** Device not available to purchase online. Please contact a sales office for pricing information.
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    Development Tools
    • Demo & Eval Boards
    • ATDH2225 ( ATDH2225 )

      ATDH2225

      ISP cable with a parallel port to attach to PCs and laptops. It supports the AT17xx family of configuration memories for configuring SRAM FPGAs.

    • ATDH2200E ( ATDH2200E )

      ATDH2200E

      AT17 series FPGA configuration memory programming board and in-system programming system (ISP).

    RoHS Information
    Part
    Number
    Device
    Weight
    Shipping
    Weight
    Lead
    Count
    Package
    Type
    Package
    Width
    Solder
    Composition
    JEDEC
    Indicator
    RoHS
     
    China
    EFUP
    AT17LV256-10PU
    0.486700
    0.900000
    8
    PDIP
    .300in
    Matte Tin
    e3
    AT17LV256-10SU
    0.542000
    0.973684
    20
    SOIC
    .300in
    Matte Tin
    e3
    AT17LV256-10SU-T
    0.542000
    0.311875
    20
    SOIC
    .300in
    Matte Tin
    e3
    AT17LV256-10NU
    0.078000
    0.160000
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    AT17LV256-10NU-T
    0.078000
    0.230303
    8
    SOIC
    .150In(3.90mm)
    Matte Tin
    e3
    AT17LV256-10JU
    0.751700
    1.428571
    20
    PLCC
    8.9x8.9x4.4mm
    Matte Tin
    e3
    AT17LV256-10JU-T
    0.751700
    1.355409
    20
    PLCC
    8.9x8.9x4.4mm
    Matte Tin
    e3
    AT17LV256-10CU
    0.074800
    0.070000
    8
    CASON
    6x6x1.04mm
    Matte Tin
    e3
    AT17LV256-10CU-T
    0.074800
    0.139333
    8
    CASON
    6x6x1.04mm
    Matte Tin
    e3
    To see a complete listing of RoHS data for this device, please Click here
    Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.