Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
RN52-I/RM110
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52CVC-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52UDF-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52SRC-I/RM100
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52APC-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52AAC-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52APT-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52ACV-I/RM116
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52APC-I/RM117
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4
RN52-I/RM
1.628200
1.500000
35
MODULE
13.4x25.8x2mm
NiAu
e4

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.