Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
PIC32MZ2048EFG144T-E/PL
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
PIC32MZ2048EFG144-I/PL
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
PIC32MZ2048EFG144T-I/PL
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
PIC32MZ2048EFG144-E/PL
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
PIC32MZ2048EFG144-I/PH
0.685500
3.888889
144
TQFP
16x16x1mm
Matte Tin
e3
PIC32MZ2048EFG144T-I/PH
0.685500
1.261111
144
TQFP
16x16x1mm
Matte Tin
e3
PIC32MZ2048EFG144-E/PH
0.685500
3.888889
144
TQFP
16x16x1mm
Matte Tin
e3
PIC32MZ2048EFG144T-E/PH
0.685500
1.261111
144
TQFP
16x16x1mm
Matte Tin
e3
PIC32MZ2048EFG144-E/JWX
0.100000
0.692308
144
TFBGA
7x7x1.02
SAC105
e8
PIC32MZ2048EFG144-I/JWX
0.100000
0.692308
144
TFBGA
7x7x1.02
SAC105
e8
PIC32MZ2048EFG144T-E/JWX
0.100000
0.337273
144
TFBGA
7x7x1.02
SAC105
e8
PIC32MZ2048EFG144T-I/JWX
0.100000
0.337273
144
TFBGA
7x7x1.02
SAC105
e8

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.