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Part Number
Device Weight
Shipping Weight
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
MCP2221A-I/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221A-I/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221AT-I/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221AT-I/STVAO
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221A-I/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221AT-I/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221A-I/ML
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
download
MCP2221AT-I/ML
0.041700
0.212121
16
QFN
4x4x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
download