Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
MCP2200-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
MCP2200T-I/SO
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
MCP2200-I/SORVB
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
MCP2200T-I/SORVB
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
MCP2200T-I/SSVAO
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2200T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2200T-E/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2200-E/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2200-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2200T-I/SSRVB
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2200-I/SSRVB
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2200-I/MQVAO
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200T-I/MQVAO
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200-I/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200T-I/MQ
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200T-I/MQRVB
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200-I/MQRVB
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2200T-E/MQVAO
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.