Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
CEC1702K-C1-SX-TR
0.214333
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702Q-C1-SX-TR
0.214333
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702H-C1-SX
0.580769
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702H-C1-SX-TR
0.214333
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702K-C1-SX
0.580769
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702Q-C1-SX
0.580769
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702Q-B1-SX
0.580769
84
WFBGA
7x7x0.8mm
SAC
e8
CEC1702Q-B1-SX-TR
0.214333
84
WFBGA
7x7x0.8mm
SAC
e8

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.