Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
ATXMEGA128A1U-AUR
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
ATXMEGA128A1U-AU
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATXMEGA128A1U-AN
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATXMEGA128A1U-ANR
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
ATXMEGA128A1U-CNR
0.139500
0.440000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATXMEGA128A1U-CUR
0.139500
0.440000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATXMEGA128A1U-CU
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATXMEGA128A1U-CN
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATXMEGA128A1U-C7UR
0.080500
0.412000
100
VFBGA
7x7x1mm
SAC105
e8
ATXMEGA128A1U-C7U
0.080500
0.038462
100
VFBGA
7x7x1mm
SAC105
e8

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.