Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
ATTINY167-SUR
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
ATTINY167-SU
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
ATTINY167-XU
0.078000
0.175676
20
TSSOP
4.4mm
Matte Tin
e3
ATTINY167-XUR
0.078000
0.200000
20
TSSOP
4.4mm
Matte Tin
e3
ATTINY167-A15MZ
0.061300
0.075200
32
VQFN
5x5x0.9mm
Matte Tin
e3
ATTINY167-MU
0.061300
0.075510
32
VQFN
5x5x0.9mm
Matte Tin
e3
ATTINY167-MUR
0.061300
0.075200
32
VQFN
5x5x0.9mm
Matte Tin
e3
ATTINY167-MMU
0.036800
0.010204
20
WQFN
4x4x0.8mm
Matte Tin
e3
ATTINY167-MMUR
0.036800
0.009667
20
WQFN
4x4x0.8mm
Matte Tin
e3

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.