Microchip Technology Inc

RoHS Device Search


Part
Number
Device
Weight
Shipping
Weight
Lead
Count
Package
Type
Package
Width
Solder
Composition
JEDEC
Indicator
RoHS
 
China
EFUP
Package Specification
ATMEGA2560V-8AU
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560V-8AUR
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560-16AUR
0.497000
1.199000
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560-16AU
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560V-8AUA0
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560-16AUA0
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
ATMEGA2560-16CUA0
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATMEGA2560-16CUR
0.139500
0.440000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATMEGA2560V-8CUA0
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATMEGA2560V-8CUR
0.139500
0.440000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATMEGA2560V-8CU
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1
ATMEGA2560-16CU
0.139500
0.928000
100
TFBGA
9x9x1.2mm
SAC305
e1

Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.
MSL* = Worst case MSL FLOOR LIFE (Reference: J-STD-020D) = Time and Conditions
MSL LEVEL
TIME
CONDITIONS
MSL-1
Unlimited
≤ 30°C/85% RH
MSL-3
168 hours
≤ 30°C/60% RH
PLEASE NOTE:

Information contained in this chart regarding package types is provided for informational purposes only and will be superseded by updates from time to time. No representation or warranty (express or implied) is given and all liability is disclaimed by Microchip Technology Incorporated with respect to the accuracy or your use of such information.