PIC18F2450

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Ideal for compact, single chip, Full Speed USB applications(12Mbit/s). The Enhanced Flash program memory allows operation when disconnected from the bus and easy field upgrades via the USB port.
USB Application Design Center
Features
    • Full Speed USB 2.0 (12Mbit/s) interface
    • 256 byte Dual Port RAM + 512 byte GP RAM
    • Full Speed USB Transceiver
    • 16 Endpoints (IN/OUT)
    • Internal Pull Up resistors (D+/D-)
    • 48 MHz performance (12 MIPS)
    • Pin-to-pin compatible with PIC16C745
 Parameter Name Value
Program Memory TypeFlash
Program Memory (KB)16
CPU Speed (MIPS)12
RAM Bytes768
Digital Communication Peripherals1-UART, 1-A/E/USART,
Capture/Compare/PWM Peripherals1 CCP
Timers1 x 8-bit, 2 x 16-bit
ADC10 ch, 10-bit
USB (ch, speed, compliance)1, Full Speed, USB 2.0
Temperature Range (C)-40 to 85
Operating Voltage Range (V)2 to 5.5
Pin Count28

Documentation & Software Back To Top

 
Data SheetsLast UpdatedSize
PIC18F2450/4450 Data Sheet03/19/20085672KB
ErrataLast UpdatedSize
PIC18F2450/4450 Data Sheet Errata05/10/2006199KB
PIC18F2450/4450 Rev. A1 Silicon Errata03/15/2006164KB
PIC18F2450/4450 Rev. A3 Silicon Errata07/23/2007253KB
PIC18F2450/4450 Rev. A4 Silicon Errata10/23/200870KB
Migration DocumentsLast UpdatedSize
Migrating from PIC18F to PIC18FXXJ Flash Devices01/12/2006253KB
PIC18F to PIC24F Migration: An Overview03/28/2006770KB
Programming SpecificationsLast UpdatedSize
PIC18F2XXX/4XXX Flash MCU Programming Specification10/12/2010388KB
Application NotesLast UpdatedSize
AN1066 - MiWi Wireless Networking Protocol Stack11/16/2010604KB
AN1095 - AN1095, Emulating Data EEPROM for PIC18 and PIC24 MCUs and dsPIC DSCs06/27/2011427KB
AN1204 - Microchip MiWi P2P Wireless Protocol11/16/2010417KB
AN1229 - Class B Safety Software Library for PIC MCUs and dsPIC DSCs04/24/2012439KB
AN1310 - High-Speed Bootloader for PIC16 and PIC18 Devices02/03/2010482KB
BrochuresLast UpdatedSize
8-bit PIC® Microcontroller Solutions05/02/20146041KB
Sell SheetsLast UpdatedSize
Choose PIC MCUs04/27/2009229KB
HI-TECH C Compilers by Microchip Technology04/08/2009900KB
MPLAB® X IDE Product Overview07/11/2011182KB
Product Selection ToolsLast UpdatedSize
Corporate Product Selector Guide10/03/20147689KB
Tips and TricksLast UpdatedSize
PIC Microcontroller Compiled Tips 'n Tricks Guide04/22/20095964KB

Pricing & Samples Back To Top

 = Sample a part     = Buy a part        All pricing shown in USD only.
Part NumberLeadsPackage TypeTemp RangePacking1-2526-99100+1000-49995000+BuySample
PIC18F2450-I/ML28QFN-40C to +85C TUBE 3.323.042.742.52 *2.40 *
PIC18F2450-I/SO28SOIC 300mil-40C to +85C TUBE 3.062.812.542.34 *2.23 *
PIC18F2450-I/SP28SPDIP-40C to +85C TUBE 3.262.992.702.49 *2.37 *
PIC18F2450T-I/ML28QFN-40C to +85C T/R 3.353.072.782.56 *2.44 *
PIC18F2450T-I/SO28SOIC 300mil-40C to +85C T/R 3.122.862.582.38 *2.26 *
PIC18LF2450-I/ML28QFN-40C to +85C TUBE 3.453.162.872.64 *2.51 *
PIC18LF2450-I/SO28SOIC 300mil-40C to +85C TUBE 3.222.952.672.46 *2.34 *
PIC18LF2450-I/SP28SPDIP-40C to +85C TUBE 3.413.132.832.60 *2.48 *
* microchipDIRECT "business" account and approved quote required. Open a microchipDIRECT account today!
** Device not available to purchase online. Please contact a sales office for pricing information.

Development Tools Back To Top

PICkit 3 In-Circuit Debugger (PG164130)
Debug Features:
Break on stack overflow:True
Pgm-memory HW breakpoints:3
Data-memory breakpoints:3
Pass counter:True

 

MPLAB ICD 3 In-Circuit Debugger (DV164035)
Debug Features:
Break on stack overflow:True
Pgm-memory HW breakpoints:3
Data-memory breakpoints:3
Pgm-memory SW breakpoints:Unlimited
Pass counter:True

 

MPLAB REAL ICE PROBE KIT (DV244005)
Debug Features:
SPI Trace:True (Requires Compiler Support)
Break on stack overflow:True
Pgm-memory HW breakpoints:3
Data-memory breakpoints:3
I/O Port Trace:True (Requires Compiler Support)
Pgm-memory SW breakpoints:Unlimited
Pass counter:True

Accessories: AC244008

 


 

RoHS Information Back To Top

Part NumberDevice Weight (Grams) eachShipping Weight (Grams) eachLead Count Package Type Package Width Solder CompositionJEDEC IndicatorRoHSChina EFUP
PIC18LF2450-I/SP 2.087500 3.733333 28 SPDIP .300in Matte Sn e3
PIC18F2450-I/SP 2.087500 3.733333 28 SPDIP .300in Matte Sn e3
PIC18F2450-I/SPREL 2.087500 3.733333 28 SPDIP .300in Matte Sn e3
PIC18F2450T-I/ML 0.101600 0.332500 28 QFN 6x6x0.9mm Matte Sn e3
PIC18LF2450-I/ML 0.101600 0.163934 28 QFN 6x6x0.9mm Matte Sn e3
PIC18F2450-I/ML 0.101600 0.163934 28 QFN 6x6x0.9mm Matte Sn e3
PIC18F2450T-I/SO 0.770400 1.152500 28 SOIC .300in Matte Sn e3
PIC18F2450-I/SO 0.770400 1.370370 28 SOIC .300in Matte Sn e3
PIC18LF2450-I/SO 0.770400 1.370370 28 SOIC .300in Matte Sn e3
To see a complete listing of RoHS data for this device, please click here
Shipping Weight = Device Weight + Packing Material weight. Please contact Sales office if device weight is not available.