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Application Notes/
Technical Brief
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AN595
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Title:
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Improving the Susceptibility of an Application to ESD-Induced Latch-up
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Name:
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AN595
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Date:
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5/1/07
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Author:
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David Wilkie
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Description:
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All semiconductor devices are sensitive to electrostatic discharge (ESD) damage to varying degrees. This is true whether they are soldered to a PC board in an application, or whether they are unattached in the shipping or application assembly process. Good handling techniques such as groundstraps, static free work stations and ionizers can reduce the risk of static build up during assembly. Often more attention is paid to reducing ESD during assembly than is paid to reducing ESD risk during the lifetime of the application.
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Keywords:
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Related Information
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App Notes and Source Code
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AN595
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