Microchip Technology Inc

Medical

Microchip offers a wide array of memory products to meet the demanding requirements of medical applications, providing you the freedom to innovate so you can take your ideas from future vision to market reality.

Microchip memory provides the following benefits, which are critical in Medical Applications

  • High Reliability–Microchip memory products offer industry leading reliability through strict burn-in testing to eliminate infant mortality. In addition, Microchip memory utilizes a historically proven memory cell design which ensures long term endurance.
  • Minimally Invasive Packaging–Microchip offers a wide range of small packaging options such as Chip Scale Package (CSP) and bare die. In addition, many customers take advantage of our custom/special packaging services.
  • Long Term Supply–Memory products are typically replaced every few years by newer parts manufactured with the latest process technology. Most suppliers discontinue support for older technologies and designs, but Microchip has a history of continued support of old products and technologies. Our EEPROMs are manufactured in our own fabrication facilities, providing us full control over the product lifecycle. This is critical in medical applications, which typically have long product lifecycles and rigorous change management.
  • Environmentally Friendly–Microchip products are RoHS compliant, Pb-free and Halide free. With the growth of at-home testing, many electronic medical devices are becoming single use and disposable. It is critical that they are safe for not only the user, but also for the environment.

Microchip provides the following services to meet the challenges of Medical applications:

  • Die / wafer sales–Bare die provides the smallest possible form factor, which is critical for wearable or implantable devices. In addition, Microchip provides custom wafer thicknesses down to 5 mils in order to further reduce the form factor.
  • Chip Scale Packaging (CSP)–CSP provides the small size of die, but with easier handling and no need for bond wires.

Featured CSP Products

  • Die Re-Distribution Layers–While packaged memory products typically have several vendors qualified, die applications are often sole-sourced due to the unique size and bond pad layout of each vendor. Microchip has the capability of matching an existing bond pad footprint with the use of a die redistribution layer.
  • Bumped Die–Microchip is capable of adding solder bumps to die in order to directly attach die to circuit boards without the need for bond wires.
  • Factory Programming–For high volume applications, programming efficiency can be greatly improved by programming many die at once in wafer form. Microchip offers in-house, secure programming services that save manufacturing time and cost by allowing customers to directly drop in the parts into their application. Pre-programmed memory is also perfect for applications where the memory is not accessible once placed in the application.
  • Other Custom Packaging Services–Microchip has a proven track record of providing bespoke packaging services for unique medical devices. If you require something not found on the shelf, our experts can help.

Typical Applications

Digital Thermometer

Blood Pressure Monitor

Glucometer

Pulse Oximeter