Microchip Technology Inc

Product Change Notifications



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Notification ID
Notification subject
Date Sent
Documents
CCB 3465 Initial Notice: Qualification of G631HQ mold compound material in selected products of 160K wafer technology available in 64L TQFP (14x14x1 mm) package using 354x354 mils lead frame paddle size at ANAP assembly site.
20-Jul-2018
    
CCB 3438 Initial Notice: Qualification of ASE as a new assembly site for selected Micrel products available in 64L LQFP (10X10X1.4 mm) package.
20-Jul-2018
    
CCB 3262, 3262.001-3262.003 Final Notice: Qualification of CuPdAu wire in selected products of the 200K wafer technology available in different QFN packages at MTAI assembly site.
19-Jul-2018
    
CCB 1737.10 Final Notice: Release to production of listed Micrel Regulator product type manufactured with the CSI05 process technology to Microchip Fab.
19-Jul-2018
        
CCB 3449 Initial PCN: Qualification of MMT as an additional site for or selected Atmel products of 66.1K and 66.2K technologies available in 48L VQFN (7x7x1mm) package with MSL 1 classification
19-Jul-2018
    
CCB 3264, CCB 3264.001- 3264.003 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 44L QFN (8x8x0.9mm), 28L VQFN (6x6x1.0mm) and 28L QFN/QFN-S(6x6x0.9mm) packages at MTAI assembly site
18-Jul-2018
    
CCB 3263, 3263.001-3263.002 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 150K and 160K wafer technologies available in 28L QFN-S (6x6mm), 28L QFN (6x6mm), 16L QFN (4x4mm) and 20L QFN (4x4mm) packages assembled at MTAI assembly site.
18-Jul-2018
    
ERRATA - PIC16(L)F18424/44/25/45 Family Silicon Errata and Data Sheet Clarification
17-Jul-2018
    
CCB 3459 Initial Notice: Qualification of MTAI as a new assembly site for selected Micrel products available in 32L VQFN (5x5x0.9mm) package.
12-Jul-2018
    
CCB 3446 Initial Notice: Qualification of ASSH as a new assembly site for selected Micrel products available in 128L PQFP (14x20x2.72mm) package.
12-Jul-2018
    
CCB 2953 Final Notice: Qualification of matte tin lead finish for selected Atmel products available in 8L SOIC at ASSH Assembly site.
11-Jul-2018
    
Data Sheet - UCS81003 Automotive USB Port Power Controller with Charger Emulation Data Sheet
11-Jul-2018
    
CRS # 17-0682 and 17-0720 Final Notice: Qualification of UMC 8S (U08S) as an additional fabrication site for additional selected ATMEL products manufactured with the 58.85K process technology.
11-Jul-2018
    
CCB 3331 Initial Notice: Qualification of MPHL as a new final test site for selected Atmel products available in 40L PDIP, 28L SPDIP and 20L PDIP packages.
10-Jul-2018
    
CCB 3200 Final Notice: Qualification of a new lead frame design of ATA6570-GNQW1 Atmel catalog part number (CPN).
10-Jul-2018
      
CCB 3230 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 160K wafer technology available in 8L MSOP package at MTAI assembly site.
09-Jul-2018
    
CCB 3181 Final Notice: Qualification of MMT as an additional assembly site for selected products available in 8L MSOP package using gold (Au) bond wire.
09-Jul-2018
    
CCB 3441 Initial Notice: Qualification of MTAI as an additional final test site for selected ATSAMD20Jxx Atmel device families available in 64L TQFP (10x10x1.0mm) package.
06-Jul-2018
    
CCB 3447 Final Notice: Implement new wafer frame carrier material for selected wafer/die sales products at MTAI assembly site.
05-Jul-2018
    
CCB 3210 Final Notice: Qualification of MTAI as a new assembly site for selected Atmel Products available in 32L VQFN package using gold (Au) bond wire
04-Jul-2018
    
CCB 3054 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 130K wafer technology available in 16L QFN package at NSEB assembly site
04-Jul-2018
    
CCB 1737.02 Final Notice: Release to production of listed Micrel Regulator product type manufactured with the BCD2 process technology to Microchip Fab.
03-Jul-2018
        
CCB 3090 Final Notice: Qualification of ASE as a new assembly site for selected products of the 0.11 wafer technology at DBHU available in 64L VQFN (8x8x0.9 mm) package.
03-Jul-2018
    
CCCB 1737.10 Final Notice: Release to production of listed Micrel regulator products type manufactured with the CSI05 process technology to Microchip Fab.
03-Jul-2018
        
CCB 3417 Final Notice: Implement Base Quantity Multiple (BQM) changes to selected Atmel Products.
03-Jul-2018