See attachments of affected catalog part
numbers (CPN) labeled as…
of G700LTD Mold Compound and 8600 Die Attach in various QFN packages using
EFTC64T LF at NSEB (UTL).
mold compound and 8006NS or 8200T die attach
mold compound and 8600 die attach
to Data Sheet:
To Improve Manufacturability
by qualifying G700LTD mold compound and 8600 die attach at this assembly site.
First Ship Date:
24, 2015 (date code: 1521)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
31, 2014: Issued initial
04, 2015: Issued final
notification. Attached the qualification report. Revised the estimated first
ship date from February 28, 2015 to May 24, 2015.
20, 2015: Revised PCN to update the devices that will be affected by
this change. Revised the attached affected parts list.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.