Microchip Technology Inc

Product Change Notification - JAON-22WRZE808   (Printer Friendly)


Date:
20 Jul 2015
Product Category:
Notification subject:
CCB 1476 Final Notice: Qualification of G700LTD Mold Compound and 8600 Die Attach in various QFN packages using EFTC64T LF at NSEB (UTL).
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
PCN_JAON-22WRZE808_Affected_CPN.xls
PCN_JAON-22WRZE808_Affected_CPN.pdf

Description of Change:
Qualification of G700LTD Mold Compound and 8600 Die Attach in various QFN packages using EFTC64T LF at NSEB (UTL).

Pre Change:
G770HCD mold compound and 8006NS or 8200T die attach

Post Change:
G700LTD mold compound and 8600 die attach

Impacts to Data Sheet: 
None 

Reason for Change:
To Improve Manufacturability by qualifying G700LTD mold compound and 8600 die attach at this assembly site.

Change Implementation Status:
In Progress

Estimated First Ship Date:
May 24, 2015 (date code: 1521)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
October 31, 2014: Issued initial notification.
May 04, 2015: Issued final notification. Attached the qualification report. Revised the estimated first ship date from February 28, 2015 to May 24, 2015.
July 20, 2015: Revised PCN to update the devices that will be affected by this change. Revised the attached affected parts list.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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