Microchip Technology Inc

Product Change Notification - JAON-19VVRT417   (Printer Friendly)


Date:
07 Oct 2015
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Touch Sensing Technologies; Analog (Thermal, Power Management & Safety); Analog (Linear & Mixed Signal) AND Interface; SMSC; 8-bit Microcontrollers
Notification subject:
CCB 1592 Final Notice: Qualification of Ag ring plated lead-frame and G700LS Mold Compound for 20L SSOP package at ANAP assembly site.
Notification text:

PCN Status: 
Final notification

Microchip Parts Affected:
Please open the attachments found in the attachments field below labeled as PCN_#_Affected_CPN.

NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).

Description of Change:
Qualification of Ag ring plated lead-frame and G700LS Mold Compound for 20L SSOP package at ANAP assembly site.

Pre Change: 
Using Spot Ag plated lead-frame and G600 mold compound.

Post Change:
Using Ag ring plated lead-frame and G700LS mold compound.

Impacts to Data Sheet: 
None 

Reason for Change:
To improve productivity and qualify Ag ring plated lead-frame and G700LS mold compound.

Change Implementation Status:
In Progress

Estimated First Ship Date:
October 15, 2015 (date code: 1542)

NOTE:  Please be advised that after the estimated first ship date customers may receive pre and post change parts.

Markings to Distinguish Revised from Unrevised Devices:  
Traceability code

Revision History:
May 27, 2015: Issued initial notification.
October 07, 2015: Issued final notification. Attached the qualification report. Updated the affected parts list.

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.



Please contact your local Microchip sales office with questions or concerns regarding this notification.

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