Please open the attachments found in the
attachments field below labeled as PCN_#_Affected_CPN.
NOTE: For your convenience Microchip
includes identical files in two formats (.pdf and .xls).
Qualification of Ag ring plated lead-frame and G700LS
Mold Compound for 20L SSOP package at ANAP assembly site.
Using Spot Ag plated
lead-frame and G600 mold compound.
Using Ag ring plated
lead-frame and G700LS mold compound.
to Data Sheet:
productivity and qualify Ag
ring plated lead-frame and G700LS mold compound.
First Ship Date:
October 15, 2015 (date code: 1542)
Please be advised that after the estimated first ship date customers may
receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
27, 2015: Issued initial
07, 2015: Issued final
notification. Attached the qualification report. Updated the affected parts
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.