See attachments of affected catalog part numbers
(CPN) labeled as…
C194 lead-frame in 64L and 44L TQFP (10x10) packages at ANAP (ATP) assembly
EFTECT-64T lead-frame material
C194 lead-frame material
to Data Sheet:
To improve on-time delivery performance
First Ship Date:
September 1, 2014 (date code: 1431)
NOTE: Please be advised that after the estimated
first ship date customers may receive pre and post change parts.
to Distinguish Revised from Unrevised Devices:
3, 2014: Issued initial
August 22, 2014: Issued final notification. Attached the
qualification report. Corrected the typographical error on the Qualification
Report (not a change to the plan) for the die attach epoxy material from 8290 (as stated on the Qual Plan)
to 3230 (Final Qual Report). Revised the estimated first ship date from August 1,
2014 to September 1, 2014.
The change described in this PCN
does not alter Microchip’s current regulatory compliance regarding the material
content of the applicable products.