Microchip Parts Affected:
See attachments of affected catalog part numbers (CPN) labeled as…
Description of Change:
Qualification of selected products available in the 28L SPDIP, 18L PDIP, and 8L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
NOTE: Selected products are non-automotive only for both standalone analog and PIC MCU product. Please review the affected CPN lists (attached) to identify the actual parts affected.
Gold (Au) wire
Palladium coated copper (PdCu) bond wire
Impacts to Data Sheet:
Reason for Change:
To improve manufacturability
Change Implementation Status:
Estimated First Ship Dates:
October 18, 2013 (Date code: 1342)
NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Markings to Distinguish Revised from Unrevised Devices:
August 23, 2013: Initial notification issue date.
September 18, 2013: Final notification issue date. Attached qualification report.
The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.