Microchip Technology Inc

Product Change Notification - CYER-09HJXI365   (Printer Friendly)


Date:
23 Aug 2013
Product Category:
16-bit Microcontrollers and Digital Signal Controllers; Touch Sensing Technologies; Analog (Linear & Mixed Signal) AND Interface; 8-bit Microcontrollers; RF and Security; Analog (Thermal, Power Management & Safety)
Notification subject:
CCB 1155.05 Initial Notification: Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.
Notification text:

PCN Status: 

Initial notification

 

Microchip Parts Affected:

See attachments of affected catalog part numbers (CPN) labeled as…

PCN_CYER-09HJXI365_Affected_CPN.xls

PCN_CYER-09HJXI365_Affected_CPN.pdf

 

Description of Change:

Qualification of selected products available in the 28L SPDIP, 8L PDIP, and 18L PDIP packages with palladium coated copper (PdCu) bond wire at MTAI assembly site.

 

NOTE: Selected products are non-automotive standalone analog and PIC MCU devices. Please review the affected CPN lists (attached) to identify the actual parts affected.      

 

Pre Change:

Gold (Au) wire

 

Post Change:

Palladium coated copper (PdCu) bond wire

 

Impacts to Data Sheet:

None

 

Reason for Change:

To improve manufacturability

 

Change Implementation Status:

In progress

 

Estimated First Ship Dates:

October 18, 2013 (Date code: 1342)  

 

NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.

 

Markings to Distinguish Revised from Unrevised Devices:   

Traceability code

 

Revision History:

August 23, 2013: Initial notification issue date.

 

The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.


Please contact your local Microchip sales office with questions or concerns regarding this notification.

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